W25Q16BV
11.2.25 Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics).
The instruction is initiated by driving the /CS pin low and shifting the instruction code “B9h” as shown in
figure 24.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-down
instruction will not be executed. After /CS is driven high, the power-down state will entered within the time
duration of t DP (See AC Characteristics). While in the power-down state only the Release from Power-
down / Device ID instruction, which restores the device to normal operation, will be recognized. All other
instructions are ignored. This includes the Read Status Register instruction, which is always available
during normal operation. Ignoring all but one instruction makes the Power Down state a useful condition
for securing maximum write protection. The device always powers-up in the normal operation with the
standby current of ICC1.
Figure 24. Deep Power-down Instruction Sequence Diagram
- 44 -
相关PDF资料
W25Q16CVSFIG IC SPI FLASH 16MBIT 16SOIC
W25Q16DWSFIG IC FLASH SPI 16MBIT 16SOIC
W25Q16VSFIG IC FLASH 16MBIT 80MHZ 16SOIC
W25Q32BVZPIG IC SPI FLASH 32MBIT 8WSON
W25Q32DWZEIG IC FLASH SPI 32MBIT 8WSON
W25Q40BWSSIG IC FLASH SPI 4MBIT 8SOIC
W25Q40BWZPIG IC FLASH SPI 4MBIT 8WSON
W25Q64BVSFIG IC SPI FLASH 64MBIT 16SOIC
相关代理商/技术参数
W25Q16BVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16BVSNIG 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3.3V 16Mbit 2M x 8bit 6ns 8-Pin SOIC
W25Q16BVSNIP 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16BVSSIG 功能描述:IC SPI FLASH 16MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G(256M x 16) 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6
W25Q16BVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM 制造商:Winbond 功能描述:SPIFLASH, 16M-BIT, 4KB UNIFORM
W25Q16BVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16BVZPIG 功能描述:IC SPI FLASH 16MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q16BVZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI